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the invisible killer of dispensing processes: these 5 common mistakes are slowly eroding your production efficiency and yield!-ag亚洲国际厅

i. inaccurate glue dispensing control: too much causes overflow, too little leads to insufficiency

error manifestations: oversized or undersized glue dots; inconsistent dot shapes; overly thick, thin, or broken glue lines; insufficient underfill or overflow.
hazards: compromises electrical connection reliability, structural strength, and sealing performance; may cause component misalignment, short circuits; increases material waste and rework costs.
root causes: unstable pressure, inaccurate time control, changes in glue viscosity, worn valves, improper parameter settings.

professional solutions:

  • high-precision dispensing machines: equip with precision metering pumps (e.g., screw valves, piezoelectric valves) and closed-loop pressure control systems to ensure highly stable and repeatable glue output.
  • dynamic viscosity compensation technology: real-time monitoring of glue viscosity and automatic parameter adjustment to address environmental or batch variations.
  • regular maintenance and calibration: strictly follow manufacturer recommendations for servicing dispensing valves and fluid systems.

ii. misalignment in dispensing position: a tiny error leads to major consequences

error manifestations: glue dots/lines fail to accurately cover solder pads, bonding areas, or sealing positions; dispensing paths deviate.
hazards: fails to achieve intended bonding, sealing, or conductive effects; may result in loose component fixation, sealing failure, or functional abnormalities.
root causes: inaccurate fixture positioning, insufficient equipment mechanical precision, visual positioning errors, incorrect program coordinate settings, incoming product deviations.

professional solutions:

  • high-precision motion platforms & visual systems: adopt high-rigidity mechanical structures, precision guide rails, and screws, paired with high-resolution industrial cameras and advanced visual positioning algorithms (e.g., pattern matching, feature recognition) to achieve sub-pixel-level positioning accuracy.
  • accurate and reliable fixtures: ensure consistent and stable product clamping.
  • program compensation & in-line inspection: utilize software compensation functions and integrate in-line aoi (automatic optical inspection) for real-time feedback and correction.

iii. stringing/trailing: affects aesthetics and hides risks

error manifestations: when the dispensing needle retracts, fine glue threads adhere to the product or substrate.
hazards: contaminates solder pads or component pins, potentially causing short circuits; impairs product appearance; broken glue strands may become foreign particles.
root causes: excessively high glue viscosity; improper needle inner diameter selection; slow needle retraction speed; poor off-glue delay settings; strong adhesion on needle surfaces.

professional solutions:

  • optimize dispensing parameters: precisely adjust off-glue time, retraction speed, and retraction parameters (if applicable).
  • select appropriate needles: choose needles with suitable inner diameter, taper, and surface coating (e.g., teflon coating) based on glue viscosity and dispensing volume.
  • glue management: ensure glue is used within recommended temperature and viscosity ranges. consider low-stringing glue formulations.
  • advanced valve technology: piezoelectric jetting valves with instantaneous shut-off capabilities significantly reduce stringing.

iv. bubble troubles: invisible defects with visible risks

error manifestations: bubbles present inside or on the surface of dispensed glue.
hazards: greatly reduces bonding strength, sealing performance, thermal/electrical conductivity; voids formed after curing pose long-term reliability risks.
root causes: air bubbles in glue; air ingress due to unsealed glue buckets or tubing; turbulent flow during dispensing entrapping air; improper glue storage/pre-treatment (e.g., lack of degassing).

professional solutions:

  • pre-dispensing glue degassing: use vacuum degassers to fully remove bubbles from glue.
  • optimize fluid pathways: use low-permeability tubing, avoid excessively long or bent tubing, and ensure tight connections.
  • adjust dispensing parameters: modify pressure and speed to avoid turbulence. consider pressure pots with built-in vacuum degassing.
  • choose low-bubble glue: collaborate with glue suppliers to specify low-bubble requirements.

v. poor curing: the final line of defense, not to be compromised

error manifestations: incomplete glue curing, excessively long curing time, or cured glue failing to meet performance standards (e.g., weak strength, tackiness).
hazards: product functional failure, shortened lifespan; potential misalignment or detachment during subsequent processes.
root causes: incorrect or unstable curing parameters (temperature, time, uv intensity); inaccurate mixing ratios for two-part glue; expired or contaminated glue; suboptimal curing environment (e.g., humidity).

professional solutions:

  • precise curing control: use ovens with uniform temperature distribution and uv curing equipment with stable, even irradiation. strictly monitor and record curing parameters.
  • accurate two-part glue mixing: deploy high-precision two-part metering and mixing dispensing systems to ensure precise ratios and thorough mixing.
  • rigorous glue management: adhere to glue storage conditions and expiration dates; allow proper warm-up and stirring before use.
  • curing degree inspection: introduce curing degree testing equipment (e.g., fourier transform infrared spectrometer) when necessary.

how to avoid these errors? partner with a professional dispensing equipment manufacturer.

as a trusted dispensing machine manufacturer, [xinghua intelligent manufacturing] deeply understands the essence and challenges of dispensing processes. we provide not just equipment, but stable, efficient, and high-precision dispensing solutions:

  • full range of high-precision dispensing platforms: covering microelectronic precision dispensing to large-scale structural adhesive coating, with core components from international top brands to ensure exceptional performance and long-term stability.
  • advanced vision & motion control: integrated high-resolution ccd vision systems and high-rigidity motion platforms achieve μm-level positioning accuracy, effectively resolving misalignment issues.
  • intelligent fluid control systems: equipped with precision screw valves, piezoelectric jetting valves, etc., combined with intelligent pressure control and viscosity compensation algorithms to ensure consistent glue output, significantly reducing stringing and bubbles.
  • mature process database & expert support: rich industry application experience, offering end-to-end technical support from equipment selection, parameter tuning to process optimization, helping you quickly overcome dispensing challenges.
  • reliable after-sales service: rapid-response localized service teams to ensure continuous and efficient equipment operation.

the perfection of dispensing lies in precise control of every detail. avoiding these common errors not only significantly improves product yield and production efficiency but also reduces overall costs and enhances market competitiveness. partnering with a professional dispensing equipment manufacturer is your optimal path to achieving stable, reliable, and efficient dispensing production.

[shenzhen xinghua intelligent manufacturing technology co., ltd.] is committed to becoming your most reliable intelligent manufacturing partner. if you are facing dispensing process challenges or aiming to enhance automation levels, please feel free to contact us. our technical experts will provide free process assessments and customized solutions.

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